Circuit QED › Interactive › Fabrication
3D InteractiveTransmon chip

Chip Fabrication

Step through the fabrication process of a standard transmon qubit chip — from bare silicon wafer to completed device. Drag to orbit, scroll to zoom.

Step 01 / 12
Silicon substrate
High-resistivity silicon wafer (~525 µm thick). Resistivity >10 kΩ·cm is critical — low microwave loss at mK temperatures is the foundation of the whole device.
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Si substrate
SiO₂
Niobium
Photoresist
MMA / PMMA
Al
AlOₓ barrier
Process summary